Mobile & IOT Forum

March 26, 2018 • Santa Clara, CA


Registered Attendee Check-in & 
Continental Breakfast

*Check-in desk will remain open until 2:00pm

9:25-9:30AM Welcome Remarks
Mian Quddus, JEDEC Chairman

Morning Session

Signs of Intelligent Life: AI Simplifies IoT
This presentation will start by discussing the various market trends where IoT device volumes have seen an explosion of demand due to the introduction of Artificial Intelligence into their usage model. The connection of these devices driving data traffic into the cloud will be covered, as well as discussion about what type of features we can look forward to in future personal and in-home devices. Finally, we will bring out what type of memory devices are being used in both the Edge devices as well as in the Cloud to make these fast-paced changes possible.
Keynote Presenter: Stephen Lum, Samsung
Opening a New Era of IoT - Opportunities and Solutions

IoT provides connections between people, devices, machines and services. It has emerged from various research explorations to become one of the hottest applications these days. This presentation will describe the overview of a few popular applications, their business opportunities, technologies in development and challenges.
Keynote Presenter: Harrison Hsieh, Mediatek

10:10-10:30AM Making Sense of Artificial Intelligence: A Practical Guide
Artificial Intelligence is one of the most important technologies today. Although it has existed in many forms for decades, recent advances in Deep Learning have finally made it marketable. There is real promise, and there are real limitations. This session will give an introductory overview of how Deep Learning works today and some insights into different deployment schemes.
Presenter: Young Paik, Samsung
10:30-10:50AM Comprehensive ARM Solutions for Innovative ML & AI Applications
With the advent of AI and the explosion of ML/CV applications, there is greater demand for system solutions to enable vendors to get to market quickly. ARM is working on holistic system enablement, while allowing the flexibility and scope to incorporate additional hardware and software optimizations into customer platforms. This talk will discuss the work ARM has been doing in these areas to provide options for a stable and efficient software and hardware architecture.
Presenter: Ray Hwang, ARM
10:50-11:10AM A Distributed World - the New IT Requirements of Edge Computing
The number of distributed, connected data sources throughout the world have been multiplying rapidly and are creating large sums of data. The IoT has now given rise to a new trend of aggregating, computing, and leveraging that data closer to where it is generated, at the IT "Edge" - between the Cloud and IoT endpoint. This presentation will provide insights into the new requirements for edge computing systems and models for how they are used.
Presenter: Jonathan Hinkle, Lenovo
11:10-11:30AM Assuring Customer Satisfaction and Competitive Advantage with the UFS Logo
JEDEC developed Universal Flash Storage (UFS) to succeed eMMC and support the next generations of mobile and IoT devices. Now UFS is beginning to show up in shipping products and an end-user installable card form factor is being defined by JEDEC. Products that take advantage of UFS’ new capabilities will achieve greater customer satisfaction and therefore a competitive advantage. It’s important that both system designers and end users know that UFS is included to provide improved performance, efficiency and price/performance flexibility.  The UFS logo is the best way to let users know that they are buying a superior product. This session explains how products can earn the UFS logo and achieve the competitive advantages they expect.
Presenter: Perry Keller, Keysight
11:30AM-1:00PM Luncheon (included)

Afternoon Session

1:00-1:20PM Watts the Difference?
The challenge of designing to mobile and internet of things markets is always the same question: How do you deliver a solution with the right combination of operating power, standby power, and environmental tolerance and yet provide memory capacity and performance? Hybrid combinations of DRAM, NAND, and NOR technologies have traditionally been used to balance these factors with varying degrees of success. Carbon nanotube memory (NRAM) allows designers to simplify the formula with a high capacity non-volatile memory device boasting DRAM-class performance and a high tolerance for heat.
Presenter: Bill Gervasi, Nantero

High Speed AND Low Power DDR DRAM? Let's Do it with LPDDR4X!
The LPDDR4X standard is the latest evolution of low-power DDR DRAM. By reducing the I/O supply voltage from 1.1v in LPDDR4 to 0.6v in LPDDR4X, the I/O power can be significantly reduced. Despite the reduction in I/O voltage, LPDDR4X can achieve the full 4267MT/s data rate promised by the LPDDR4X standard, even in quad die packages.

This presentation will show how to take advantage of LPDDR4 and LPDDR4X in a range of applications from mobile to consumer to automotive, necessary features of the interface, techniques for achieving high speed LPDDR4/4X, and will show the design margin that can be achieved even with reduced voltage I/O.
Presenter: Marc Greenberg, Cadence

1:40-2:00PM Way to be a Market Winner: UFS Card
Demand for faster mobile storage is dramatically increasing everywhere we look. Examples include 4K/8K high resolution video, 3D games, VR (Virtual Reality) and so on. To satisfy the insatiable market demand for removable cards, a standard for UFS cards was published by JEDEC in March 2016. Samsung will give the technical, performance, power consumption, financial, development, and validation advantages of the UFS Card. Adopting the UFS Card could make your IT products the market winner.
Presenter: Hyung-Seuk Kim, Samsung
2:00-2:20PM Flash Storage and Sensor Interfaces for Mobile and IoT SoCs
Storage devices are a vital component of an electronic system for a variety of applications, and with today’s demand for faster boot-up and data transfer, choosing an optimized storage device has become a challenge for designers. For example, for mainstream smartphones, embedded technologies like eMMC has become the de facto storage device of choice due to its high-speed connectivity up to 400MB/s and cost-effectiveness. On the other hand, for high-end smartphones, UFS has become a robust option due to its unique high-performance, low-power and scalability advantages. Today, the use of such mobile storage devices extends into new applications like automotive and IoT. This presentation will describe each mobile storage specification and illustrate their unique use-cases and features such as command queuing, inline encryption and high bandwidth for mobile applications and beyond. 
Presenter: Licinio Sousa, Synopsys
2:20-2:40PM UFS 3.0: Controller Design Considerations
UFS specification is a breakthrough for Managed NAND, overcoming 3~4 years of stagnation. UFS 2.1 performance enters the Desktop-PC class while keeping limited power budget with mobile-oriented form-factors. UFS 3.0 doubles the interface speed, forcing flash memory, controller and firmware into radical changes. Latest flash memory technologies require the best calculation-demanding ECC engines (StrongECC™, LDPC) and Flash Translation Layer (FTL) management. The UFS performance highlights the importance of having total domain over the controller development, the recipe that leads to a high efficiency controller architecture.  High speed interface brings signal Integrity concerns requiring a layout that considers the limitations of die placement and substrate routing. To overcome this issue, packaging-oriented pad position and a capacitor-free design contribute to low-cost and high quality product.
Presenter: Keith Tsai, Phison
2:40-3:00PM Bridge Controller Helps Proliferate UFS Card in IT Products
Although the UFS card is desired for IT products such as tablets, notebooks, drones, cameras, etc. due to its storage density, speed, performance and low power, but there is still limited AP (Application processor) to support the UFS interface. The UFS Bridge Controller that comes with the USB3.0 interface will help overcome this limitation. IT products which do not have a UFS interface can improve the sequential and random read/write performance via existing USB3.0 interface to access the UFS removable card. The UFS bridge controller could be adopted as the external card reader or embedded as a removable card socket controller to reveal the benefits of the UFS card. Products that come with UFS features could be a distinct differentiator to help increase your product’s attractiveness.
Presenter: LC Tai, Dediprog
3:00-3:20PM MIPI Alliance: How Mobile Specifications are Driving IOT
Peter Lefkin, Managing Director of MIPI Alliance, will provide an overview of MIPI Alliance Specifications in IoT and Automotive. Peter will provide additional context, background and a forward look regarding the implementation of MIPI Specifications in mobile influenced industries of automotive and internet of things. MIPI Alliance specifications are developed for mobile devices as the primary target though MIPI Alliance members have leveraged and evolved their investments in mobile to other platforms including automotive and IoT. MIPI specifications are implemented in IoT devices for augmented and virtual reality, wearables, and other low power and sensor connected devices. Within automotive, automobiles have become a new platform for innovation and manufacturers are implementing MIPI specifications to develop applications for infotainment, advanced driver assistance systems (ADAS), and safety. Interconnected components for these applications include high-performance cameras and imaging sensors, infotainment and dashboard displays, telematics hubs among others. Automotive and IoT platforms are heavily reliant on sensors and MIPI specifications will play a key role enabling sensor-based applications and connected devices.
Presenter: Peter Lefkin, MIPI

Emerging Test & Measurement Needs for Mobile/IoT Market
The Mobile/IoT sector is being served by thousands of companies globally which has led to the evolution of many of the high speed serial standards at both JEDEC (UFS, LPDDR) and MIPI (M-PHY, I3C, D-PHY/C-PHY). Some of the biggest challenges in this industry are delivering products with reduced BOM, optimal electrical specifications and margins along with a shorter time to market. As design margins shrink, getting deeper insight into standard-specific measurements is crucial. Comprehensive tools for debugging failures are key to building confidence that your product will pass compliance and achieve certification. The in-depth discussion on these topics will help you simplify your validation tasks, moving from complexity to confidence.
Presenter: Keyur Diwan, Tektronix


UFS Card Socket
In this presentation, Amphenol will introduce the JEDEC UFS Card Socket form factor as well as the UFS Card form factor, and how the UFS card is beneficial for industry. In addition, the UFS card could benefit your socket design which could be used as reference socket for many IT products like VR, AR, Drones, etc. The socket for the UFS Card is available now and its characteristics would be shared for IT vendors.
Presenter: Zhineng Fan, Amphenol

Program, topics and speakers subject to change without notice.