ROCS Workshop

Monday, May 9th in Monterey, CA

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JEDEC looks forward to welcoming you back to in-person events with the 36th Annual ROCS (Reliability of Compound Semiconductors) Workshop. The Workshop will once again be co-located with the CS MANTECH Conference, with the objective of bringing together researchers, manufacturers and users of compound semiconductor devices. 

2022 ROCS Agenda

Morning Session

7:30-8:00AMOnsite check-in for registered attendees
8:00-8:10AM

Welcome & Opening Remarks

Randy Lewis, Northrop Grumman Corporation

8:10-8:40AM

Standards for Wide Bandgap Power Conversion Device Reliability, Qualification, Test and Datasheet Parameters: Progress, Influence and Future Plans of JEDEC Committee JC-70

Presented by: Tim McDonald, Infineon

8:40-9:10AM

900V GaN - Designing for Reliability

Presented by: Ron Barr, Transphorm

9:10-9:40AM

The Physics Behind Dynamic On-Resistance in eGaNFETS

Presented by: Robert Strittmatter Ph.D., EPC

9:40-10:00AMBreak
10:00-10:30AM

SiC Power Device Reliability and Robustness - Failure Mechanisms and Predictive Life Models

Presented by: Don Gajewski, Wolfspeed

10:30-11:05AM

Comparison of Quantitative and Qualitative Thermal Measurement Techniques on Commercially Available GaN HEMT Transistor

Presented by: Paul Hayes, Quantum Focus Instruments Corporation

11:05-11:40AM

Practical Challenges of RF Accelerated Life Testing

Presented by: Roland Shaw, Accel-RF Instruments Corporation

11:40AM-Noon

Modeling of GaN HEMT Reliability Time Evolution and Field Effects

Presented by: Gergana Drandova, Qorvo

Noon-1:00PMLunch
Afternoon Session  
1:00-1:20PM

Temperature Acceleration and Path to Reliability without Hermiticity for RF-GaN HEMT

Presented by: Satyaki Ganguly, Wolfspeed

1:20-1:40PM

High Temperature Operation of Beta-Ga2O3 MOSFET

Presented by: Ahmad Islam, AFRL

1:40-2:00PM

Reliability Study of GaAs and AIGaAs PIN Diodes

Presented by: James Carter, MACOM

2:00-4:00PM

Joint Session with the MANTECH Workshop / Advanced Packaging: Critical Ecosystems and Reliability Considerations

Presented by: David Shahin and Kaysar Rahim, Northrop Grumman Corporation

4:00-4:20PM

High Temperature Stress Testing a Commercial SiGe HBT Process to Evaluate Transistor and Interconnect Reliability

Presented by: Michael Langlois, Northrop Grumman Corporation

4:20-4:40PM

Towards More Efficient and Accurate Quality and Reliability Estimates; Repairing Widely Used Methods

Presented by: Charles Recchia, IEEE Reliability Society

4:40-5:00PM

Commercial-Off-the-Shelf AIGaN/GaN HEMT Long Term Aging Effects Study at Slightly Elevated Channel Temperatures

Presented by: Brian Poling, AFRL


 

Presenters and topics subject to change without notice.