ROCS Workshop

Monday, May 9th in Monterey, CA

Online registration is now closed.  Registration will be available onsite for $275 per person. PayPal is the only payment method available. Please note an account is not required to process a credit card using PayPal.

JEDEC looks forward to welcoming you back to in-person events with the 36th Annual ROCS (Reliability of Compound Semiconductors) Workshop. The Workshop will once again be co-located with the CS MANTECH Conference, with the objective of bringing together researchers, manufacturers and users of compound semiconductor devices. 

2022 ROCS Agenda

Morning Session

7:30-8:00AMOnsite check-in for registered attendees

Welcome & Opening Remarks

Randy Lewis, Northrop Grumman Corporation


Standards for Wide Bandgap Power Conversion Device Reliability, Qualification, Test and Datasheet Parameters: Progress, Influence and Future Plans of JEDEC Committee JC-70

Presented by: Tim McDonald, Infineon


900V GaN - Designing for Reliability

Presented by: Ron Barr, Transphorm


The Physics Behind Dynamic On-Resistance in eGaNFETS

Presented by: Robert Strittmatter Ph.D., EPC


SiC Power Device Reliability and Robustness - Failure Mechanisms and Predictive Life Models

Presented by: Don Gajewski, Wolfspeed


Comparison of Quantitative and Qualitative Thermal Measurement Techniques on Commercially Available GaN HEMT Transistor

Presented by: Paul Hayes, Quantum Focus Instruments Corporation


Practical Challenges of RF Accelerated Life Testing

Presented by: Roland Shaw, Accel-RF Instruments Corporation


Modeling of GaN HEMT Reliability Time Evolution and Field Effects

Presented by: Gergana Drandova, Qorvo

Afternoon Session  

Temperature Acceleration and Path to Reliability without Hermiticity for RF-GaN HEMT

Presented by: Satyaki Ganguly, Wolfspeed


High Temperature Operation of Beta-Ga2O3 MOSFET

Presented by: Ahmad Islam, AFRL


Reliability Study of GaAs and AIGaAs PIN Diodes

Presented by: James Carter, MACOM


Joint Session with the MANTECH Workshop / Advanced Packaging: Critical Ecosystems and Reliability Considerations

Presented by: David Shahin and Kaysar Rahim, Northrop Grumman Corporation


High Temperature Stress Testing a Commercial SiGe HBT Process to Evaluate Transistor and Interconnect Reliability

Presented by: Michael Langlois, Northrop Grumman Corporation


Towards More Efficient and Accurate Quality and Reliability Estimates; Repairing Widely Used Methods

Presented by: Charles Recchia, IEEE Reliability Society


Commercial-Off-the-Shelf AIGaN/GaN HEMT Long Term Aging Effects Study at Slightly Elevated Channel Temperatures

Presented by: Brian Poling, AFRL


Presenters and topics subject to change without notice.