Standards & Documents Search

Displaying 1 - 20 of 1419 documents. Show 5 | 10 | 20 | 40 | 60 results per page.

Title	Document #	Date
DDR5 CAMM2, 1.00 MM X 1.38 MM PITCH MICROELECTRONIC ASSEMBLY	MO-358A	Sep 2023
Designator: XBNA-N#_I1p0_... Item No: 14-218 Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
PLASTIC DUAL SMALL OUTLINE, GULL WING, 2.00 MM PITCH, RECTANGULAR PACKAGE	MO-359A	Sep 2023
Designator: H-PDSO-G12_12p0-12p0x9p4Z2p8 Item No: 11-1034 Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
STANDARD MANUFACTURERS IDENTIFICATION CODE NOTE: JEP106U was in error starting with bank two an additional continuation code was added, JEP106U should be discarded.	JEP106BH	Sep 2023
The manufacturers identification code is defined by one or more 8 bit fields, each consisting of 7 data bits plus 1 odd parity bit. The manufacturers identification code is assigned, maintained and updated by the JEDEC Office. The intent of this identification code is that it may be used whenever a digital field is required, e.g., hardware, software, documentation, etc. To make a request for an ID Code please go to https://www.jedec.org/standards-documents/id-codes-order-form Committee(s): JC-42, JC-42.3 Free download. Registration or login required.
DDR5 DIMM Labels	JESD401-5B	Aug 2023
The following labels shall be applied to all DDR5 memory modules to fully describe the key attributes of the module. The label can be in the form of a stick-on label, silk screened onto the assembly, or marked using an alternate customer-readable format. A readable point size should be used, and the number can be printed in one or more rows on the label. Hyphens may be dropped when lines are split, or when font changes sufficiently. Committee(s): JC-45 Free download. Registration or login required.
PART MODEL SCHEMAS	JEP30-10v3-0-0	Aug 2023
This download includes all files under the parent schema JEP30-10v3-0-0 (Committees: JC-11, JC-11.2) including: JEP30-A101v2-0-1 (Assembly Process), Committees: JC-11, JC-11.2, JC-14 JEP30-E101v2-0-1 (Electrical), Committees: JC-11, JC-11.2, JC-16 JEP30-P101v3-0-0 (Package), Committees: JC-11, JC-11.2 JEP30-S101v1-0-1 (Supply Chain), Committees: JC-11, JC-11.2, JC-14 JEP30-T101v2-0-1 (Thermal) Committees: JC-11, JC-11.2, JC-15 JEP30-D10v3-0-0 (Types Dictionary) Committees: JC-11, JC-11.2 This will enable the user to validate the schemas. For more information visit the main JEP30 webpage. Committee(s): JC-11, JC-11.2, JC-14, JC-15, JC-16 Free download. Registration or login required.
Annex K, Raw Card K, in 260-Pin, 1.2 V (VDD), PC4-1600/PC4-1866/PC4-2133/PC4-2400/PC4-2666/PC4-3200 DDR4 SDRAM SODIMM Design Specification Release Number: 33	MODULE4.20.25.K.01	Aug 2023
This revision is to add R/C K1 for up to PC4-3200 support for the DDR4 SO-DIMM R/C K Annex. Item 2228.68. Committee(s): JC-45.3 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
Part Model Package Guidelines for Electronic-Device Packages – XML Requirements	JEP30-P100B	Aug 2023
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the "Package" subsection of the Part Model. For more information visit the main JEP30 webpage. Committee(s): JC-11, JC-11.2 Free download. Registration or login required.
Part Model Electrical Guidelines for Electronic-Device Packages – XML Requirements	JEP30-E100B	Aug 2023
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, Electrical, assembly process classification data along with materials and substances that may be present in the supplied product or subproducts. This Guideline specifically focuses on the “Electrical” sub-section of the Part Model. For more information visit the main JEP30 webpage. Committee(s): JC-11, JC-11.2, JC-16 Free download. Registration or login required.
Part Model Guidelines for Electronic-Device Packages – XML Requirements	JEP30B	Aug 2023
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It covers several sub-sections such as electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the parental structure, under which several sub-section listed above, can be contained and linked together within the Part Model parent structure. For more information visit the main JEP30 webpage. Committee(s): JC-11, JC-11.2 Free download. Registration or login required.
DESCRIPTIVE DESIGNATION SYSTEM FOR ELECTRONIC-DEVICE PACKAGES	JESD30K	Aug 2023
This standard establishes requirements for the generation of electronic-device package designators for the JEDEC Solid State Technology Association. The requirements herein are intended to ensure that such designators are presented in as uniform a manner as practicable. Item 11.2-1031S. NOTE IF YOU DOWNLOADED THIS DOCUMENT PRIOR TO 12/16/2022 PLEASE DISCARD AND VIEW AGAIN, PREVIOUS VERSION CONTAINED FORMAT ISSUES. Committee(s): JC-11.2 Free download. Registration or login required.
SHIPPING AND HANDLING TRAY FOR 1.00 MM CAMM2 CONNECTOR	CO-040A	Aug 2023
Designator: N/A Item #: 11.5-1033 - STP file to follow Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
LPDDR5 CAMM2, 1.38 MM X 1.00 MM PITCH MICROELECTRONIC ASSEMBLY	MO-357A	Aug 2023
Designator: XBMA-H644_I1p0_R78p0x23p0Z2p6 Item #: 11.14-219 - STP file to follow Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
PLASTIC QUAD FLATPACK 1.27 MM PITCH, 5.00 MM X 6.00 MM RECTANGULAR FAMILY PACKAGE	MO-356A	Aug 2023
Designator: PQFP-B#[#]_Ip27... Item #: 11-1037 - STP files to follow Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Bottom Grid, Array Ball, 0.50 mm Pitch Rectangular Family	MO-276U	Aug 2023
Designator: PBGA-B#[#]I0p5... Item JC11.11-1036 Cross Reference: DR4.5 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
TS511X, TS521X Serial Bus Thermal Sensor Device Standard	JESD302-1A	Aug 2023
This standard defines the specifications of interface parameters, signaling protocols, and features for fifth generation Temperature Sensor (TS5) as used for memory module applications. These device operate on I2C and I3C two-wire serial bus interface. The designation TS521X and TS511X refers to the device specified by this document. Committee(s): JC-40.1 Free download. Registration or login required.
REGISTRATION - Upper PoP, Plastic Bottom Grid Array Ball, 0.40 mm Pitch Rectangular Family Package	MO-344B	Aug 2023
Designator: PBGA-B#[#]_I0p40... Item: 11.11-1035, Access STP File for MO-344A Cross Reference: DR4.18 Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 288 Pin DDR5 DIMM, 0.85 mm Pitch Microelectronic Assembly	MO-329F	Aug 2023
Designator: PDMA-N288-I0p85-R133p8x#p#7Z31p8R2p55x0p6 Item: 11.14-220, Access STP Files for MO-329E Cross Reference: MO-329, SO-023, GS-010 Patents(): Micron: US7,547,213. Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Quad Flatpack, 8 Terminal, 1.27 mm Pitch Package	MO-341B	Aug 2023
Designator: PQFP-F8[10]_I127-R5p51x6.54Z1P1 Item: 11-1030-STP file to follow Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
JOINT JEDEC/ESDA STANDARD FOR ELECTROSTATIC DISCHARGE SENSITIVITY TEST - HUMAN BODY MODEL (HBM) - COMPONENT LEVEL	JS-001-2023	Jul 2023
This standard establishes the procedure for testing, evaluating, and classifying components and microcircuits according to their susceptibility (sensitivity) to damage or degradation by exposure to a defined human body model (HBM) electrostatic discharge (ESD). The purpose (objective) of this standard is to establish a test method that will replicate HBM failures and provide reliable, repeatable HBM ESD test results from tester to tester, regardless of component type. Repeatable data will allow accurate classifications and comparisons of HBM ESD sensitivity levels. NOTE Data previously generated with testers meeting all waveform criteria of ANSI/ESD STM5.1-2007 or JESD22A-114F shall be considered valid test data. Also available JTR-001-01-12: User Guide of ANSI/ESDA/JEDEC JS-001, Human Body Model Testing of Integrated Circuits Committee(s): JC-14, JC-14.1 Free download. Registration or login required.
Registration - Plastic Dual Upper to Bottom, 1.8 mm x 1.00 mm Pitch Connector (CMT)	SO-032A	Jul 2023
Designator: PDUtBXC-H... Item: 11.14-215, Access STP File for SO-032A Cross Reference: N/A Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.

Standards & Documents Search

DDR5 CAMM2, 1.00 MM X 1.38 MM PITCH MICROELECTRONIC ASSEMBLY

PLASTIC DUAL SMALL OUTLINE, GULL WING, 2.00 MM PITCH, RECTANGULAR PACKAGE

STANDARD MANUFACTURERS IDENTIFICATION CODE

DDR5 DIMM Labels

PART MODEL SCHEMAS

Annex K, Raw Card K, in 260-Pin, 1.2 V (VDD), PC4-1600/PC4-1866/PC4-2133/PC4-2400/PC4-2666/PC4-3200 DDR4 SDRAM SODIMM Design Specification

Part Model Package Guidelines for Electronic-Device Packages – XML Requirements

Part Model Electrical Guidelines for Electronic-Device Packages – XML Requirements

Part Model Guidelines for Electronic-Device Packages – XML Requirements

DESCRIPTIVE DESIGNATION SYSTEM FOR ELECTRONIC-DEVICE PACKAGES

SHIPPING AND HANDLING TRAY FOR 1.00 MM CAMM2 CONNECTOR

LPDDR5 CAMM2, 1.38 MM X 1.00 MM PITCH MICROELECTRONIC ASSEMBLY

PLASTIC QUAD FLATPACK 1.27 MM PITCH, 5.00 MM X 6.00 MM RECTANGULAR FAMILY PACKAGE

Registration - Plastic Bottom Grid, Array Ball, 0.50 mm Pitch Rectangular Family

TS511X, TS521X Serial Bus Thermal Sensor Device Standard

REGISTRATION - Upper PoP, Plastic Bottom Grid Array Ball, 0.40 mm Pitch Rectangular Family Package

Registration - 288 Pin DDR5 DIMM, 0.85 mm Pitch Microelectronic Assembly

Registration - Plastic Quad Flatpack, 8 Terminal, 1.27 mm Pitch Package

JOINT JEDEC/ESDA STANDARD FOR ELECTROSTATIC DISCHARGE SENSITIVITY TEST - HUMAN BODY MODEL (HBM) - COMPONENT LEVEL

Registration - Plastic Dual Upper to Bottom, 1.8 mm x 1.00 mm Pitch Connector (CMT)

Pages

Search by Keyword or Document Number

Filter by committees:

Filter by document type:

Filter by keywords: