Global Standards for the Microelectronics Industry
Standards & Documents Search
| Title | Document # |
Date |
|---|---|---|
Registration - Shipping and Handling Tray for DDR5 DIMM Microelectronic Assembly |
CO-036B | Oct 2021 |
Designator: N/A Committee(s): JC-11.5 Free download. Registration or login required. |
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REGISTRATION - Battery Cell R/A SMT Type Connector, 1.2 mm Pitch |
SO-028A | Oct 2021 |
Designator: PSXC-L6_I1p2-R11p6x5p85Z2p07-R0p3x0p6ET0p07 Committee(s): JC-11.14 Free download. Registration or login required. |
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REGISTRATION - Battery Cell R/A T/H Type Connector, 1.2 mm Pitch |
SO-026A | Oct 2021 |
Designator: PSXC-P6_I1p2-R11p6x5p85Z2p0-R0p3x0p31H1p16 Committee(s): JC-11.14 Free download. Registration or login required. |
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DDR5 SDRAM |
JESD79-5A | Oct 2021 |
This document defines the DDR5 SDRAM specification, including features, functionalities, AC and DC characteristics, packages, and ball/signal assignments. The purpose of this Standard is to define the minimum set of requirements for JEDEC compliant 8Gb through 32Gb for x4, x8, and x16 DDR5 SDRAM devices. This standard was created based on the DDR4 standards (JESD79-4) and some aspects of the DDR, DDR2, DDR3 & LPDDR4 standards (JESD79, JESD79-2, JESD79-3 & JESD209-4). Item 1848.99K. Committee(s): JC-42.3B Available for purchase: $369.00 Add to Cart Paying JEDEC Members may login for free access. |
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DEFINITION OF SSTU32865 REGISTERED BUFFER WITH PARITY FOR 2R x 4 DDR2 RDIMM APPLICATIONS |
JESD82-9B.01 | Oct 2021 |
This standard provides the functional definition, ball-out configuration and package outline, signal definitions and input/output characteristics for a 28-bit 1:2 registered driver with parity suitable for use on DDR2 RDIMMs. The SSTU32865 integrates the functional equivalent of two SSTU32864 devices (as defined in JESD82-7) into a single device, thereby easing layout and board design constraints especially on high density RDIMMs such as dual rank, by four configurations. Moreover, the optional use of a parity function is provided for, permitting detection and reporting of parity errors across its 22 data inputs. JESD82-9 specifies a 160-pin Thin-profile, fine-pitch ball-grid array (TFBGA) package. This is a minor editorial revision as shown in Annex A of the document. Free download. Registration or login required. |
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STANDARD FOR DEFINITION OF THE SSTV16859 2.5 V, 13-BIT TO 26-BIT SSTL_2 REGISTERED BUFFER FOR STACKED DDR DIMM APPLICATIONS: |
JESD82-4B.01 | Oct 2021 |
This standard defines standard specifications of dc interface parameters, switching parameters, and test loading for definition of the SSTV16859 13-bit to 26-bit SSTL_2 registered buffer for stacked DDR DIMM applications. The purpose is to provide a standard for the SSTV16859 logic device, for uniformity, multiplicity of sources, elimination of confusion, ease of device specification, and ease of use. This is a minor editorial revision, shown in Annex A of the document. Committee(s): JC-40 Free download. Registration or login required. |
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DEFINITION OF THE SSTUA32866 1.8 V CONFIGURABLE REGISTERED BUFFER WITH PARITY TEST FOR DDR2 RDIMM APPLICATIONS |
JESD82-16A.01 | Oct 2021 |
This standard defines standard specifications of dc interface parameters, switching parameters, and test loading for definition of the SSTUA32866 registered buffer with parity test for DDR2 RDIMM applications. The purpose is to provide a standard for the SSTUA32866 (see Note) logic device, for uniformity, multiplicity of sources, elimination of confusion, ease of device specification, and ease of use. This is a minor editorial revision as shown in Annex A of the document. Free download. Registration or login required. |
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DEFINITION OF THE SSTUB32868 1.8 V CONFIGURABLE REGISTERED BUFFER WITH PARITY FOR DDR2 RDIMM APPLICATIONS |
JESD82-14A.01 | Oct 2021 |
This standard defines standard specifications of dc interface parameters, switching parameters, and test loading for definition of the SSTUB32868 registered buffer with parity test for DDR2 RDIMM applications. SSTU32S2868 denotes a single-die implementation and SSTU32D868 denotes a dual-die implementation. This is a minor editorial revision as shown in Annex A of the document. Committee(s): JC-40 Free download. Registration or login required. |
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Registration - Battery Cell Wire Side Connector, 1.2 mm pitch |
SO-027A | Sep 2021 |
Designator: PBXC-q6_i1P2-r7P9X4P25z1P58Item: 11.14-199, Access STP Files for SO-027ACross Reference: N/A Committee(s): JC-11.14 Free download. Registration or login required. |
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TEST METHOD FOR BEAM ACCELERATED SOFT ERROR RATE |
JESD89-3B | Sep 2021 |
This test is used to determine the terrestrial cosmic ray Soft Error Rate (SER) sensitivity of solid state volatile memory arrays and bistable logic elements (e.g., flip-flops) by measuring the error rate while the device is irradiated in a neutron or proton beam of known flux. The results of this accelerated test can be used to estimate the terrestrial cosmic ray induced SER for a given terrestrial cosmic ray radiation environment. This test cannot be used to project alpha-particle induced SER. Committee(s): JC-14.1 Free download. Registration or login required. |
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Addendum No. 1 to JESD251 - OPTIONAL x4 QUAD I/O WITH DATA STROBE |
JESD251-1.01 | Sep 2021 |
This purpose of the addendum is to add an optional 4-bit bus width (x4) to JESD251, xSPI standard. The xSPI interface currently supports a x1 interface that acts as a bridge to legacy SPI functionality as well as the x8 interface intended to achieve dramatically higher bus performance than legacy SPI memory implementations. Item 1775.15. This is an editorial revision to JESD251-1, October 2018 Committee(s): JC-42.4 Free download. Registration or login required. |
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MEASUREMENT AND REPORTING OF ALPHA PARTICLE AND TERRESTRIAL COSMIC RAY INDUCED SOFT ERRORS IN SEMICONDUCTOR DEVICES |
JESD89B | Sep 2021 |
This specification defines the standard requirements and procedures for terrestrial soft-error-rate (SER) testing of integrated circuits and reporting of results. Both real-time (unaccelerated) and accelerated testing procedures are described. At terrestrial, Earth-based altitudes, the predominant sources of radiation include both cosmic-ray radiation and alpha-particle radiation from radioisotopic impurities in the package and chip materials. An overall assessment of a deviceís SER is complete, only when an unaccelerated test is done, or accelerated SER data for the alpha-particle component and the cosmic-radiation component has been obtained. Free download. Registration or login required. |
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Registration - Plastic, Ultra, Extra and Super Thin, Fine Pitch, Dual Small Outline, Flat, Leaded Package. (U, X1, X2)F-PSOF, HX2-PSOF. |
MO-293B | Sep 2021 |
Item 11.10-459 Committee(s): JC-11.10 Free download. Registration or login required. |
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EXPANDED SERIAL PERIPHERAL INTERFACE (xSPI) FOR NON VOLATILE MEMORY DEVICES |
JESD251B | Sep 2021 |
This standard is intended for use by SoC, ASIC, ASSP, and FPGA developers or vendors interested in incorporating a master interface having a low signal count and high data transfer bandwidth with access to multiple sources of slave devices compliant with the interface. It is also, intended for use by peripheral developers or vendors interested in providing slave devices compliant with the standard, including non-volatile memories, volatile memories, graphics peripherals, networking peripherals, FPGAs, sensors, etc. Item 1775.64. Committee(s): JC-42.4 Free download. Registration or login required. |
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DDR5 REGISTERING CLOCK DRIVER DEFINITION (DDR5RCD01) |
JESD82-511 | Aug 2021 |
This document defines standard specifications of DC interface parameters, switching parameters, and test loading for definition of the DDR5 Registering Clock Driver (RCD) with parity for driving address and control nets on DDR5 RDIMM and LRDIMM applications. The DDR5RCD01 Device ID is DID = 0x0051. Committee(s): JC-40.4 Free download. Registration or login required. |
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DDR5 288 Pin U/R/LR DIMM Connector Performance Standard, DDR5 |
PS-005A.01 | Aug 2021 |
Committee(s): JC-11.14 Free download. Registration or login required. |
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ENCLOSURE FORM FACTOR FOR SSD DEVICES, VERSION 1.0 |
JESD253.01 | Aug 2021 |
This document specifies the enclosure form factor which can be used with various type of SSD devices: outline of the top and bottom enclosure, three screw holes to mount the enclosure on the system, and two clamping holes in the top enclosure to lock to the connector. Item 318.06. This is a minor editorial revision detailed in Annex D. Committee(s): JC-64.8 Free download. Registration or login required. |
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GENERAL REQUIREMENTS FOR DISTRIBUTORS OF COMMERCIAL AND MILITARY SEMICONDUCTOR DEVICES |
JESD31F | Aug 2021 |
This standard identifies the general requirements for Distributors that supply Commercial and Military products. This standard applies to all discrete semiconductors, integrated circuits and Hybrids, whether packaged or in wafer/die form, manufactured by all Manufacturers. The requirements defined within this document are only applicable to products for which ownership remains with the Distributor or Manufacturer. Free download. Registration or login required. |
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XFM DEVICE, Version 1.0 |
JESD233 | Aug 2021 |
This standard specifies the mechanical and electrical characteristics of the XFM Device. Such characteristics include, among others, package dimensions, pin layout, signal assignment, power supply voltages, currents, and electrical characteristics of the PCIe interface. Committee(s): JC-64 Free download. Registration or login required. |
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COPY-EXACT PROCESS FOR MANUFACTURING |
JEP185 | Aug 2021 |
This publication defines the requirements for Copy-Exact Process (CEP) matching, real-time process control, monitoring, and ongoing assessment of the CEP. The critical element requirements for inputs, process controls, procedures, process indicators, human factors, equipment/infrastructure and matching outputs are given. Manufacturers, suppliers and their customers may use these methods to define requirements for process transfer within the constraints of their business agreements. Committee(s): JC-14.3 Free download. Registration or login required. |
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