Global Standards for the Microelectronics Industry
Standards & Documents Search
Title | Document # |
Date![]() |
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Registration - Small Outline (SO) Package Family 8.4 mm (.330 inch) Body Width (Plastic) with Increased Lead Thickness to 11.8 mil max. Item 11.11-214. |
MO-059-B | Jan 1987 |
Committee(s): JC-11.11 Free download. Registration or login required. |
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Registration - Small Outline Plastic Surface Mount Package with 2 Gullwing Terminals. Includes Errata to DO-215, May 1998. Item 11.1-655(e). |
DO-215-D | Apr 2003 |
Committee(s): JC-11.10, JC-11.1 Free download. Registration or login required. |
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Design Requirements - Thin Small Outline Package, TSOP - Type 2. |
DG-4.15B | May 2004 |
Item 11.2-675(s) Committee(s): JC-11.2 Free download. Registration or login required. |
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Registration - Small Outline Plastic Surface Mount. PSOF-2. Item 10-431. |
DO-220-B | Oct 2004 |
Free download. Registration or login required. |
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48 Lead, Very, Very Thin Small Outline Package, Type 1. WR-PDSO1, WSOP1. Item 11.11-701. |
MO-259-A | Mar 2005 |
Free download. Registration or login required. |