Global Standards for the Microelectronics Industry
Standards & Documents Search
Title | Document # |
Date![]() |
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184-Pin PC-2700 SDRAM Unbuffered DIMM - TSOP-Based DRAMs Design Specification |
MODULE4.20.8 | May 2021 |
Release No. 31This revision contains terminology updates only. JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
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184 Pin Unbuffered SDR SDRAM DIMM Family |
MODULE4.5.11 | May 2021 |
Release No.31This revision contains terminology updates only. Committee(s): JC-42 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
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240-Pin Unbuffered and Registered DDR2 SDRAM DIMM Family |
MODULE4.5.14 | May 2021 |
Release No. 31This revision contains terminology updates only. JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
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184 Pin Unbuffered DDR SDRAM DIMM |
MODULE4.5.10 | May 2021 |
Release No.31This revision contains terminology updates only. JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
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Addendum No. 1 to JESD79-4, 3D STACKED DRAM |
JESD79-4-1B | Feb 2021 |
This document defines the 3DS DDR4 SDRAM specification, including features, functionalities, AC and DC characteristics, packages, and ball/signal assignments. The purpose of this specification is to define the minimum set of requirements for a compliant 8 Gbit through 128 Gbit for x4, x8 3DS DDR4 SDRAM devices. This addendum was created based on the JESD79-4 DDR4 SDRAM specification. Each aspect of the changes for 3DS DDR4 SDRAM operation was considered. Item 1727.58G Committee(s): JC-42.3C Free download. Registration or login required. |