Global Standards for the Microelectronics Industry
Standards & Documents Search
Title | Document # |
Date![]() |
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Design Requirements - Wafer Level Ball Grid Arrays (WLBGA). |
DR-4.18A.01 | Apr 2021 |
Item 11.2-965(E) Free download. Registration or login required. |
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Registration - Plastic Bottom Grid Array, 0.80 MM Pitch, Rectangular Family Package |
MO-210Q | Jan 2021 |
Designator: PBGA-B#[#]_I0p... Patents(): May apply: Micron: 6,048,753. Tessera: 5,950,304; and 6,133,627 Committee(s): JC-11.11 Free download. Registration or login required. |
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Registration - Plastic Bottom Grid, Array Ball, 0.50 mm Pitch, Rectangular Family Package |
MO-276P | Jan 2021 |
Designator: PBGA-B#[#]_I0p5... Cross Reference: DR4.5 Committee(s): JC-11.11 Free download. Registration or login required. |
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Design Requirements - Ball Grid Array Package (BGA) |
DR-4.14J.01 | Feb 2019 |
Item 11.2-948E Committee(s): JC-11.2 Free download. Registration or login required. |
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Design Requirements - Ball Grid Array Package (BGA) and Interstitial Ball Grid Array Package (IBGA) |
DR-4.5N.01 | Nov 2018 |
Ball Pitch = 0.40, 0.50, 0.65, 0.75 and 0.80 mm. Body sizes = ≤ 21 mm.Item 11.2-968E, Editorial Change. Committee(s): JC-11.2 Free download. Registration or login required. |