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Displaying 1 - 10 of 16 documents. Show 5 | 10 results per page.

Title	Document #	Date
Design Requirements - General Requirements	DG-4.2	Jan 1980
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Design Requirements - Metric Small Outline J-Leaded Package Design Guide	DG-4.13	Aug 1996
Committee(s): JC-11, JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.
Design Requirements - Plastic Ultra-Thin Small outline No-Lead Package. R-PDSO-N/USON.	DG-4.16A	Feb 1998
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Design Requirements - Generic Matrix Tray for Handling and Shipping (Low Stacking Profile for BGA Packages).	DG-4.9A	Mar 2000
Item 11.2-539S Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Design Requirements - Quad Flatpack	DG-4.4A	Jun 2000
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Design Requirements - Generic Matrix Tray for Handling and Shipping, includes addition of optional side-wall bar code feature.	DG-4.10D	Oct 2002
Item 11.2-615s Committee(s): JC-11, JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.
Design Requirements - Thin Small Outline Package, TSOP - Type 2.	DG-4.15B	May 2004
Item 11.2-675(s) Committee(s): JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.
Design Requirements - Punch-Singulated, Fine Pitch, Square, Very Thin and Very Very Thin Profile, Leadframe-Based Quad No-Lead Staggared Dual-Row Packages, (with optional Thermal Enhancements) QFN.	DG-4.23A	Nov 2005
Item 11.2-728(S) Committee(s): JC-11, JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.
Design Requirements - Plastic Quad and Dual Inline, Square and Rectangular, No-Lead Packages (with Optional Thermal Enhancements). QFP-N/SO-N.	DG-4.8C	Sep 2006
Item 11.2-713(s) Committee(s): JC-11, JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.
Design Requirements - Internal Stacking Module, Land Grid Array Packages with External Interconnect Terminals (ISM).	DG-4.21A	Feb 2007
Item 11.2-699(S) Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.

Standards & Documents Search

Design Requirements - General Requirements

Design Requirements - Metric Small Outline J-Leaded Package Design Guide

Design Requirements - Plastic Ultra-Thin Small outline No-Lead Package. R-PDSO-N/USON.

Design Requirements - Generic Matrix Tray for Handling and Shipping (Low Stacking Profile for BGA Packages).

Design Requirements - Quad Flatpack

Design Requirements - Generic Matrix Tray for Handling and Shipping, includes addition of optional side-wall bar code feature.

Design Requirements - Thin Small Outline Package, TSOP - Type 2.

Design Requirements - Punch-Singulated, Fine Pitch, Square, Very Thin and Very Very Thin Profile, Leadframe-Based Quad No-Lead Staggared Dual-Row Packages, (with optional Thermal Enhancements) QFN.

Design Requirements - Plastic Quad and Dual Inline, Square and Rectangular, No-Lead Packages (with Optional Thermal Enhancements). QFP-N/SO-N.

Design Requirements - Internal Stacking Module, Land Grid Array Packages with External Interconnect Terminals (ISM).

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