Standards & Documents Search

Displaying 1 - 10 of 17 documents. Show 5 | 10 results per page.

Title	Document #	Date
STANDARD - Dual In-Line Gauge. (Ties with all Shrink P-DIPs). Variations AA-BD. Item 11.11-315.	GS-003C	Mar 1993
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thermally Enhanced Low Profile Plastic Dual, Flat No Lead Package. L-PDFP-N. Item 11.10-412	MO-232-A	Aug 2001
Committee(s): JC-11, JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thermally Enhanced Plastic Very Thin Dual Row Fine Pitch Quad Flat No Lead Package. HP-VFQFP-N. Item 11.11-680	MO-239-B	Nov 2002
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - High Profile Plastic Thermally Enhanced Enlarged Pitched Dual Flat No Lead Package. HE-PDFP-N. Item 11.11-638.	MO-245-A	Sep 2003
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Dual Inline Memory Module (DIMM) Family, 184 Pin DDR w/ 1.27 mm Contact Centers. Item 11.14-078	MO-206-E	Jan 2006
Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Design Requirements - Plastic Quad and Dual Inline, Square and Rectangular, No-Lead Packages (with Optional Thermal Enhancements). QFP-N/SO-N.	DG-4.8C	Sep 2006
Item 11.2-713(s) Committee(s): JC-11, JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - DDR2 SDRAM DIMM (Dual Inline memory Module) Family, Flex-Based, 1.00 mm Contact Centers.	MO-281-A	Nov 2006
Item 11.14-100 Patents(): STAKTEK: See Outline Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - FBDIMM (Fully Buffered Dual Inline Memory Module) Family, 1.00 mm Contact Centers.	MO-256-F	Jun 2007
Item 11.14-108 Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Small Scale, Plastic, Ultra, Extra, and Super Thin, Fine Pitch, Dual Small Outline, No Lead Package. (U, X1, X2)F-PSON.	MO-287-A	Sep 2007
Item 11.11-777 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - DDR3 SDRAM DIMM (Dual Inline Memory Module) Family, Flex-Based, 1.00 mm contact Centers	MO-290-A	Nov 2007
Item 11.14-118 Patents(): STAKTEK, See Outline Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.

Standards & Documents Search

STANDARD - Dual In-Line Gauge. (Ties with all Shrink P-DIPs). Variations AA-BD. Item 11.11-315.

Registration - Thermally Enhanced Low Profile Plastic Dual, Flat No Lead Package. L-PDFP-N. Item 11.10-412

Registration - Thermally Enhanced Plastic Very Thin Dual Row Fine Pitch Quad Flat No Lead Package. HP-VFQFP-N. Item 11.11-680

Registration - High Profile Plastic Thermally Enhanced Enlarged Pitched Dual Flat No Lead Package. HE-PDFP-N. Item 11.11-638.

Registration - Dual Inline Memory Module (DIMM) Family, 184 Pin DDR w/ 1.27 mm Contact Centers. Item 11.14-078

Design Requirements - Plastic Quad and Dual Inline, Square and Rectangular, No-Lead Packages (with Optional Thermal Enhancements). QFP-N/SO-N.

Registration - DDR2 SDRAM DIMM (Dual Inline memory Module) Family, Flex-Based, 1.00 mm Contact Centers.

Registration - FBDIMM (Fully Buffered Dual Inline Memory Module) Family, 1.00 mm Contact Centers.

Registration - Small Scale, Plastic, Ultra, Extra, and Super Thin, Fine Pitch, Dual Small Outline, No Lead Package. (U, X1, X2)F-PSON.

Registration - DDR3 SDRAM DIMM (Dual Inline Memory Module) Family, Flex-Based, 1.00 mm contact Centers

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