Global Standards for the Microelectronics Industry
Standards & Documents Search
| Title | Document # |
Date |
|---|---|---|
TEST METHOD FOR THE MEASUREMENT OF MOISTURE DIFFUSIVITY AND WATER SOLUBILITY IN ORGANIC MATERIALS USED IN ELECTRONIC DEVICES |
JESD22-A120C | Jan 2022 |
This standard details the procedures for the measurement of characteristic bulk material properties of moisture diffusivity and water solubility in organic materials used in the packaging of electronic devices. These two material properties are important parameters for the effective reliability performance of plastic packaged surface mount devices after exposure to moisture and subjected to high temperature solder reflow. Committee(s): JC-14.1 Free download. Registration or login required. |
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Test Procedure for the Measurement of Terrestrial Cosmic Ray Induced Destructive Effects in Power Semiconductor Devices |
JEP151A | Jan 2022 |
This test method defines the requirements and procedures for terrestrial destructive* single-event effects (SEE) for example, single-event breakdown (SEB), single-event latch-up (SEL) and single-event gate rupture (SEGR) testing . It is valid when using an accelerator, generating a nucleon beam of either; 1) Mono-energetic protons or mono-energetic neutrons of at least 150 MeV energy, or 2) Neutrons from a spallation spectrum with maximum energy of at least 150 MeV. This test method does not apply to testing that uses beams with particles heavier than protons. *This test method addresses a separate risk than does JESD89 tests for non-destructive SEE due to cosmic radiation effects on terrestrial applications.
Committee(s): JC-14.1 Free download. Registration or login required. |
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IC LATCH-UP TEST |
JESD78F | Jan 2022 |
This standard covers the I-test and Vsupply overvoltage latch-up testing of integrated circuits. The purpose of this standard is to establish a method for determining IC latch-up characteristics and to define latch-up detection criteria. Latch-up characteristics are extremely important in determining product reliability and minimizing No Trouble Found (NTF) and Electrical Overstress (EOS) failures due to latch-up. This test method is applicable to NMOS, CMOS, bipolar, and all variations and combinations of these technologies. This standard has been adopted by the Defense Logistics Agency (DLA) as project 5962-1880. Committee(s): JC-14.1 Free download. Registration or login required. |
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SEMICONDUCTOR WAFER AND DIE BACKSIDE EXTERNAL VISUAL INSPECTION |
JESD22-B118A | Nov 2021 |
This inspection method is for product semiconductor wafers and dice prior to assembly. This test method defines the requirements to execute a standardized external visual inspection and is a non-invasive and nondestructive examination that can be used for qualification, quality monitoring, and lot acceptance. Committee(s): JC-14.1 Free download. Registration or login required. |
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TEST METHOD FOR BEAM ACCELERATED SOFT ERROR RATE |
JESD89-3B | Sep 2021 |
This test is used to determine the terrestrial cosmic ray Soft Error Rate (SER) sensitivity of solid state volatile memory arrays and bistable logic elements (e.g., flip-flops) by measuring the error rate while the device is irradiated in a neutron or proton beam of known flux. The results of this accelerated test can be used to estimate the terrestrial cosmic ray induced SER for a given terrestrial cosmic ray radiation environment. This test cannot be used to project alpha-particle induced SER. Committee(s): JC-14.1 Free download. Registration or login required. |
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GENERAL REQUIREMENTS FOR DISTRIBUTORS OF COMMERCIAL AND MILITARY SEMICONDUCTOR DEVICES |
JESD31F | Aug 2021 |
This standard identifies the general requirements for Distributors that supply Commercial and Military products. This standard applies to all discrete semiconductors, integrated circuits and Hybrids, whether packaged or in wafer/die form, manufactured by all Manufacturers. The requirements defined within this document are only applicable to products for which ownership remains with the Distributor or Manufacturer. Free download. Registration or login required. |
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COPY-EXACT PROCESS FOR MANUFACTURING |
JEP185 | Aug 2021 |
This publication defines the requirements for Copy-Exact Process (CEP) matching, real-time process control, monitoring, and ongoing assessment of the CEP. The critical element requirements for inputs, process controls, procedures, process indicators, human factors, equipment/infrastructure and matching outputs are given. Manufacturers, suppliers and their customers may use these methods to define requirements for process transfer within the constraints of their business agreements. Committee(s): JC-14.3 Free download. Registration or login required. |
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TEST METHOD FOR ALPHA SOURCE ACCELERATED SOFT ERROR RATE |
JESD89-2B | Jul 2021 |
This test method is offered as standardized procedure to determine the alpha particle Soft Error Rate (SER) sensitivity of solid state volatile memory arrays and bistable logic elements (e.g. flipflops) by measuring the error rate while the device is irradiated by a characterized, solid alph source. Free download. Registration or login required. |
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TEST METHOD FOR REAL-TIME SOFT ERROR RATE |
JESD89-1B | Jul 2021 |
This test is used to determine the Soft Error Rate (SER) of solid state volatile memory arrays and bistable logic elements (e.g. flip-flops) for errors which require no more than re-reading or re-writing to correct and as used in terrestrial environments. It simulates the operating condition of the device and is used for qualification, characterization, or reliability monitoring. This test is intended for execution in ambient conditions without the artificial introduction of radiation sources. Free download. Registration or login required. |
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METHODS FOR CALCULATING FAILURE RATES IN UNITS OF FITS |
JESD85A | Jul 2021 |
This standard establishes methods for calculating failure rates in units of FITs by using data in varying degrees of detail such that results can be obtained from almost any data set. The objective is to provide a reference to the way failure rates are calculated. Committee(s): JC-14.3 Free download. Registration or login required. |
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