Global Standards for the Microelectronics Industry
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Displaying 1 - 2 of 2 documents.
Title | Document # |
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CHARACTERIZATION AND MONITORING OF THERMAL STRESS TEST OVEN TEMPERATURESStatus: Reaffirmed September 2019 |
JEP153A | Mar 2014 |
This document provides an industry standard method for characterization and monitoring thermal stress test oven temperatures. The procedures described in this document should be used to insure thermal stress test conditions are being achieved and maintained during various test procedures. Free download. Registration or login required. |
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ELECTRICAL PARAMETERS ASSESSMENTStatus: Reaffirmed May 2014, September 2020 |
JESD86A | Oct 2009 |
This standard is intended to describe various methods for obtaining electrical variate data on devices currently produced on the manufacturing and testing process to be qualified. The intent is to assess the device's capability to function within the specification parameters over time and the application environment (operating range of temperature, voltage, humidity, input/output levels, noise, power supply stability etc.). Committee(s): JC-14.3 Free download. Registration or login required. |