Global Standards for the Microelectronics Industry
JC-14 Quality and Reliability of Solid State Products
JC-14 is responsible for standardizing quality and reliability methodologies for solid state products used in commercial applications such as computers, automobiles, telecommunications equipment, etc. It also includes developing standards for board-level reliability of solid state products used in commercial equipment.
The committee is comprised of both suppliers and users and furnishes a forum where concerns of the industry for solid state device quality and reliability issues can be resolved. The committee maintains liaisons with other JEDEC committees whose tasks are related to quality and reliability issues. In addition, the committee coordinates activities with other standards organizations such as IPC, IEC, and JEITA to help develop industry and worldwide standardization.
Find JC-14’s complete scope in JM18: JEDEC Committee Scope Manual.
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|CONSTANT-TEMPERATURE AGING METHOD TO CHARACTERIZE COPPER INTERCONNECT METALLIZATIONS FOR STRESS-INDUCED VOIDING||JESD214.01||Aug 2017|
|STRESS-TEST-DRIVEN QUALIFICATION OF INTEGRATED CIRCUITS||JESD47J||Aug 2017|
|TEMPERATURE, BIAS, AND OPERATING LIFE||JESD22-A108F||Jul 2017|
|JOINT JEDEC/ESDA STANDARD FOR ELECTROSTATIC DISCHARGE SENSITIVITY TEST - HUMAN BODY MODEL (HBM) - COMPONENT LEVEL||JS-001-2017||May 2017|
|WIRE BOND SHEAR TEST||JESD22-B116B||May 2017|
|FAILURE-MECHANISM-DRIVEN RELIABILITY MONITORING||JESD659C||Apr 2017|
|PRECONDITIONING OF NONHERMETIC SURFACE MOUNT DEVICES PRIOR TO RELIABILITY TESTING||JESD22-A113H||Nov 2016|
|RESISTANCE TO SOLDER SHOCK FOR THROUGH-HOLE MOUNTED DEVICES||JESD22-B106E||Nov 2016|
|BOARD LEVEL DROP TEST METHOD OF COMPONENTS FOR HANDHELD ELECTRONIC PRODUCTS||JESD22-B111A||Nov 2016|
|GUIDELINES FOR PACKING AND LABELING OF INTEGRATED CIRCUITS IN UNIT CONTAINER PACKING (Tubes, Trays, and Tape and Reel)||JEP130B||Nov 2016|