Global Standards for the Microelectronics Industry
JC-14 Quality and Reliability of Solid State Products
JC-14 is responsible for standardizing quality and reliability methodologies for solid state products used in commercial applications such as computers, automobiles, telecommunications equipment, etc. It also includes developing standards for board-level reliability of solid state products used in commercial equipment.
The committee is comprised of both suppliers and users and furnishes a forum where concerns of the industry for solid state device quality and reliability issues can be resolved. The committee maintains liaisons with other JEDEC committees whose tasks are related to quality and reliability issues. In addition, the committee coordinates activities with other standards organizations such as IPC, IEC, and JEITA to help develop industry and worldwide standardization.
Find JC-14’s complete scope in JM18: JEDEC Committee Scope Manual.
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|Joint ESDA/JEDEC - CDM Technical User Guide||JTR002-01-22||Jan 2023|
|ESDA/JEDEC JOINT STANDARD FOR ELECTROSTATIC DISCHARGE SENSITIVITY TESTING – CHARGED DEVICE MODEL (CDM) – DEVICE LEVEL||JS-002-2022||Jan 2023|
|Survey On Latch-Up Testing Practices and Recommendations for Improvements||JEP193||Jan 2023|
|THERMAL SHOCK||JESD22-A106B.02||Jan 2023|
|IC LATCH-UP TEST||JESD78F.01||Dec 2022|
|JOINT IPC/JEDEC Standard for Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Devices||J-STD-035A||Dec 2022|
|JOINT IPC/JEDEC Standard Moisture/Reflow Sensitivity Classification for Non-hermetic Surface Mount Devices (SMDs)||J-STD-020F||Dec 2022|
|STRESS-TEST-DRIVEN QUALIFICATION OF INTEGRATED CIRCUITS||JESD47L||Dec 2022|
|TEMPERATURE, BIAS, AND OPERATING LIFE||JESD22-A108G||Nov 2022|
|Wire Bond Pull Test Methods||JESD22-B120||Nov 2022|