Global Standards for the Microelectronics Industry
Mobile Memory: LPDDR, Wide I/O, Memory MCP
First published in August 2014 and most recently updated in November 2015, JESD209-4 LPDDR4 is designed to significantly boost memory speed and efficiency for mobile devices. LPDDR4 will eventually operate at an I/O rate of 4266 MT/s, twice that of LPDDR3. To achieve this performance, the committee completely redesigned the architecture, going from a one-channel die with 16 bits per channel to a two-channel die with 16 bits per channel, for a total of 32 bits. For more information about LPDDR4 including the steps taken to save power, see the LPDDR4 press release. Download JESD209-4A LPDDR4.
Published in September 2014, Wide I/O 2 offers a significant speed increase over Wide I/O, while retaining Wide I/O’s vertically stacked through silicon via (TSV) architecture and optimized packaging. Combined, these characteristics position Wide I/O 2 to deliver the ever-increasing speed, capacity, and power efficiency demanded by mobile devices such as smartphones, tablets and handheld gaming consoles. Download JESD229-2.
Wide I/O 2 provides four times the memory bandwidth (up to 68GBps) of the previous version of the standard, but at lower power consumption (better bandwidth/Watt) with the change to 1.1V supply voltage. From a packaging standpoint, the Wide I/O 2 die is optimized to stack on top of a system on chip (SOC) to minimize power consumption and footprint.
Wide I/O 2 mobile DRAM is an extension of the breakthrough technology pioneered with the publication of Wide I/O. Just as switching to multicore processors significantly increased overall computer speed without the need to jump to a new process node, so the vertically stacked architecture allows the Wide I/O 2 interface to deliver four times the bandwidth of LPDDR4 DRAM for around one quarter of the I/O speed.
With the recent publication of LPDDR4, these two new standards from JEDEC offer designers a range of mobile memory solutions, allowing for maximum flexibility. Designers working with a horizontal architecture can choose LPDDR4, while those working with a vertical architecture are supported by Wide I/O 2. In either case, the committee worked to deliver the memory performance that the market requires.
Published in December 2011 by JC-42.6, Wide I/O Mobile DRAM is a breakthrough technology that will meet industry demands for increased levels of integration as well as improved performance, bandwidth, latency, power, weight and form factor. Download JESD229 Wide I/O Single Data Rate (SDR).
Wide I/O Mobile DRAM uses chip-level three dimensional (3D) stacking with Through Silicon Via (TSV) interconnects and memory chips directly stacked upon a System on a Chip (SoC). Wide I/O is particularly suited for applications requiring increased memory bandwidth up to 17GBps, such as 3D Gaming, HD Video (1080p H264 video, pico projection), simultaneously-running applications, etc. Wide I/O will provide the ultimate in performance, energy efficiency and small size for smartphones, tablets, handheld gaming consoles and other high performance mobile devices.
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|Multichip Packages (MCP) and Discrete e•MMC, e•2MMC, and UFS||MCP3.12.1||Feb 2018|
|LOW POWER DOUBLE DATA RATE 4 (LPDDR4)||JESD209-4B||Mar 2017|
|ADDENDUM NO. 1 to JESD209-4, LOW POWER DOUBLE DATA RATE 4X (LPDDR4X)||JESD209-4-1||Jan 2017|
|0.6 V LOW VOLTAGE SWING TERMINATED LOGIC (LVSTL06)||JESD8-29||Dec 2016|
|JC-42.6 MANUFACTURER IDENTIFICATION (ID) CODE FOR LOW POWER MEMORIES||JEP166B||Feb 2016|
|LOW POWER DOUBLE DATA RATE 3 SDRAM (LPDDR3)||JESD209-3C||Aug 2015|
|WIDE I/O 2 (WideIO2)||JESD229-2||Aug 2014|
|HSUL_12 LPDDR2 AND LPDDR3 I/O WITH OPTIONAL ODT||JESD8-22B||Apr 2014|
|LOW POWER DOUBLE DATA RATE 2 (LPDDR2)||JESD209-2F||Jun 2013|
|Package-on-Package (PoP) and Internal Stacked Module (ISM)||MCP3.12.2||Jan 2012|