Global Standards for the Microelectronics Industry
JEP30: PartModel Guidelines
JEP30 and its related documents are currently published and maintained as a JEDEC-wide project between the JC-11, JC-14, JC-15 and JC-16 Committees. JEP30 establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. As one example, the standard could be used to define a part in sufficient detail to enable process efficiencies during the part and product life cycles, i.e., design, purchasing, manufacturing, quality control, test, material deceleration, supply chain, etc.
The standard is designed to be scalable insofar that it should cover as many components as possible that are available in the market. It should also be scalable to encompass the emergence of new parts in the future. This standard applies to all forms of electronic parts.
JEP30 covers the parental structure for the assembly process classification, electrical, physical, thermal, material deceleration, supply chain including product change notice and product discontinuance data. The parent schema file is JEP30-10, PartModel XML Schema.
Users can validate their PartModel.xml files against the JEP30-10 Schema here: https://www.jedec.org/sites/default/files/jep30partmodel/v3-0-0/JEP30-10v3-0-0.xsd
Users can incorporate the PartModel schema or any of its sub-sections within their schemas by obtaining a direct link to these schemas here.
The following table shows the PartModel schema parent files associated with each sub-section technical schema. The Schema Types Dictionary (JEP30-D10) is a shared schema across all the other schema.
|Document||Title||Pub. Date||XML Schema File||Schema Version|
|JEP30B||PartModel Guidelines for Electronic-Device Packages - XML Requirements||8/2023||JEP30-10||Ver 3-0-0|
|JEP30-A100A||PartModel Assembly Process Classification Guidelines for Electronic-Device Packages - XML Requirements||3/2023||JEP30-A101||Ver 2-0-1|
|JEP30-E100B||PartModel Electrical Guidelines for Electronic-Device Packages - XML Requirements||8/2023||JEP30-E101||Ver 2-0-1|
|JEP30-P100B||PartModel Package Guidelines for Electronic-Device Packages - XML Requirements||8/2023||JEP30-P101||Ver 3-0-0|
|JEP30-S100||PartModel Supply Chain Guidelines for Electronic-Device Packages - XML Requirements||3/2023||JEP30-S101||Ver 1-0-1|
|JEP30-T100A||PartModel Thermal Guidelines for Electronic-Device Packages - XML Requirements||3/2023||JEP30-T101||Ver 2-0-1|
|PartModel Schema Types Dictionary||3/2023||JEP30-D10||Ver 3-0-0|
*All subschemas are released under the umbrella of the Part Model Schema to ensure that the Part Model Schema is referencing the correct version of the subschema. In addition, this enables the subschema to connect to the Manufacturer Part Number and the Manufacturer of the Part.
Previous versions of the PartModel can be accessed here.
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|PART MODEL SCHEMAS||JEP30-10v3-0-0||Aug 2023|
|Part Model Electrical Guidelines for Electronic-Device Packages – XML Requirements||JEP30-E100B||Aug 2023|
|Part Model Package Guidelines for Electronic-Device Packages – XML Requirements||JEP30-P100B||Aug 2023|
|Part Model Guidelines for Electronic-Device Packages – XML Requirements||JEP30B||Aug 2023|
|Part Model Thermal Guidelines for Electronic-Device Packages – XML Requirements||JEP30-T100A||Mar 2023|
|Part Model SupplyChain Guidelines for Electronic-Device Packages – XML Requirements||JEP30-S100||Mar 2023|
|Part Model Assembly Process Classification Guidelines for Electronic-Device Packages – XML Requirements||JEP30-A100A||Mar 2023|