Global Standards for the Microelectronics Industry
JEP30: Part Model Guidelines
JEP30 and its related documents are currently published and maintained as a JEDEC-wide project between the JC-11, JC-14, JC-15 and JC-42 Committees. JEP30 establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. As one example, the standard could be used to define a part in sufficient detail to enable process efficiencies during the part and product life cycles, i.e., design, purchasing, manufacturing, quality control, test, etc.
The standard is designed to be scalable insofar that it should cover as many components as possible that are available in the market. It should also be scalable to encompass the emergence of new packages in the future. This standard applies to all forms of electronic parts.
JEP30 covers the parental structure for the electrical, physical, thermal, and assembly process classification data. The parent schema file is JEP30-10, Part Model XML Schema.
Users can validate their PartModel.xml files against the JEP30-10 Schema here: https://www.jedec.org/sites/default/files/jep30partmodel/JEP30-10%20Part%20Model%20Schema%20Ver%201-0-0.xsd
The Schema files associated with these documents form the Part Model XML Schema. The zip file provided includes 3 files: 1) the Part Model Schema (JEP30-10), 2) the associated document schema, and 3) the Schema Types Dictionary (JEP30-D10).
|Document||Title||Pub. Date||XML Schema File|
|JEP30-A100||Part Model Assembly Process Classification Guidelines for Electronic-Device Packages - XML Requirements||2/2018||JEP30-A101X|
|JEP30-E100||Part Model Electrical Guidelines for Electronic-Device Packages - XML Requirements||4/2018||JEP30-E101X|
|JEP30-P100||Part Model Package Guidelines for Electronic-Device Packages - XML Requirements||5/2018||JEP30-P101X|
|JEP30-R100||Part Model Procurement Guidelines for Electronic-Device Packages - XML Requirements||JEP30-R101X|
|JEP30-T100||Part Model Thermal Guidelines for Electronic-Device Packages - XML Requirements||4/2018||JEP30-T101X|
*All subschemas are released under the umbrella of the Part Model Schema to ensure that the Part Model Schema is referencing the correct version of the subschema. In addition, this enables the subschema to connect to the Manufacturer Part Number and the Manufacturer of the Part.
Future releases will add procurement related data that also require standardization across the industry.