Global Standards for the Microelectronics Industry
Registered Outlines: JEP95
JEP95, JEDEC Registered and Standard Outlines for Solid State and Related Products, is a compilation of some 3000 pages of outline drawings for microelectronic packages including transistors, diodes, DIPS, chip carriers, sockets, and package interface BGA outlines in both inch and metric versions. There are over 500 registrations in all.
The JEDEC JC-11 Committee on Mechanical Standardization develops the outlines in JEP95 and is responsible for updating the publication.
An annual updating service for JEP95 is available by subscription. Subscribers receive periodic electronic updates for replacement or insertion into the hard copy JEP95. Each year approximately 4-6 updates are distributed.
A complete hard copy of JEP95 is available for purchase. The hard copy comes in two 4” wide 3-ring binders so that future updates can be added with ease. A master index is included.
- About Publication 95 (JEP95)
- JEP95 Table of Contents
- Section 1: Preparation and Submission of Solid State Product Outline Drawings (Includes Terms and Definitions for JEP95)
- Section 2: Symbols List
- Section 3: Standard Practices and Procedures Table of Contents
- JEP95 Master Index to Outlines/Standards
JEDEC Design Guides (was JESD95-1, now section 4 in JEP95)
Carrier Outlines (CO)
Carrier Standards (CS)
Diode Outline (DO)
Microelectronic Outline (MO)
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|Registration - Silicon Bottom Grid Array Column, 0.048 x 0.0275 Pitch, Rectangular Family Package||MO-316B||Apr 2019|
|Standard - Plastic Dual Small Outline (SO) Family, Gull Wing, 1.27 mm Pitch Package. PDSO-G.||MS-012G.01||Apr 2019|
|Registration - 262 Pin SODIMM, 0.50 mm Pitch Package||MO-337A||Apr 2019|
|Registration - 262 Pin DDR5 SODIMM, 0.50 mm Pitch Socket||SO-024A||Apr 2019|
|Design Requirements - Ball Grid Array Package (BGA)||DR-4.14J.01||Feb 2019|
|Registration - Plastic Multi Position Flange Mount Mixed Technology, 0.10 in. Pitch Package||TO-220L||Jan 2019|
|Design Requirements - Ball Grid Array Package (BGA)||DR-4.27F.01||Nov 2018|
|Design Requirements - Ball Grid Array Package (BGA) and Interstitial Ball Grid Array Package (IBGA)||DR-4.5N.01||Nov 2018|
|Registration - Plastic Bottom Grid Array, Ball 0.70 mm Pitch, Square Family||MO-336A||Nov 2018|
|Registration - Plastic Bottom Grid Array Ball, 0.80 mm Pitch Square Family Package||MO-216F||Nov 2018|