Automotive Electronics Forum Tokyo: Agenda

Wednesday, November 16


Registered Attendee Check-in

9:20-9:25AMWelcome Remarks

Osamu Nagashima, JEITA

9:25-9:30AMWelcome Remarks

Mian Quddus, JEDEC Board of Directors


Kazuyoshi Tsukada, Memory Expert

Morning Session


Automotive Memory: Driving Intelligent Mobility, while Fueling the Evolution of an Entire Industry

Keynote Presenter: Hyunduk Cho, Samsung

Samsung foresees memory becoming one of the most critical pillars of change for the automotive industry, thanks to current and upcoming advancements in intelligent mobility, and is already playing a leading role in working to enable this. Automotive technology and the expanding automotive ecosystem demand not only massive amounts of data creation, but also an embrace of high performance operations. This necessitates a reshaping of Auto E/E architecture, which some equate to transforming it into the equivalent of a server on wheels. However, technology requirements for automotive applications have not yet fully aligned with the semiconductor business and its rapid technological evolution. Currently, the automotive business requires more cutting-edge technology to meet future intelligent automobile developments. Samsung believes that the memory industry can be the single most important catharsis for greater technological advancement. Memory, in fact, has been an incredible microcosm of innovation for decades, as can be seen in the Mobile, PC, and Server/Storage areas. We foresee such memory initiative will impact automotive technology and the automotive business much more than ever before, and at the same time, enable it to evolve more rapidly. In this talk, we are proposing a series of technology solutions that will accelerate the inevitable journey of the automotive business from horsepower to silicon power.


Electronic Components for e-Mobility Architectures

Keynote Presenter: Kirk Ouellette, ST

The adoption of electric vehicles brings with it a significant number of critical challenges that electronic component technology and architectures are poised to address. Due to their fast-switching speed Wide bandgap (WBG) devices like silicon carbide (SiC) or gallium nitride (GaN), open up major design opportunities for power conversion architecture such as for on-board charging and motor traction inverters, as well as for off-board charging and grid infrastructures. WBG performance in high voltage, high frequency and high efficiency is an ideal choice for automotive, but also can serve industrial applications by taking advantage and experience to address two different market volumes for a cost-effective solution. Better power density, reduced heat dissipation requirements, higher voltage levels to reduce currents and therefore the weight of the cables, their adoption is conditioned by improved processes to reduce the cost of ownership, by standardized qualification with a low environmental footprint. New component technologies provide system more efficient such as for battery management, when the new generations of processors address zoning (network by physical location rather than by function) and the resulting benefits in terms of security, cable weight, energy management and distribution, throughput and latency, services and architecture SW. In conclusion, only a holistic approach to the system by mastering the end-to-end environment can provide a global, optimized and sustainable solution.


Implementing ISO26262 Functional Safety (FuSa) Requirements for an LPDDR5X Memory Controller and PHY Subsystem
Presenter: Marc Greenberg, Cadence

The next generation of high performance vehicle control systems will have the ability to process large amounts of sensor data with powerful algorithms and machine learning to provide autonomous or semi-autonomous driving ability. These control systems require a large amount of processing ability and high memory bandwidth, and LPDDR5X is an excellent choice of DRAM memory for this application. This presentation will discuss the functional safety targets required for an LPDDR5X Memory Controller and PHY subsystem intended for automotive applications, including quality process, Automotive Safety Features (ASF), error correction, built-in self test (BIST), Failure Mode, Effect and Diagonostic Analysis (FMEDA), Fault metrics, Safety Manual, and certification; all from the perspective of the implementer who will need to design the System-on-Chip (SoC) containing the LPDDR5X interface to the DRAM.


Architecting Memory Solutions to Meet Rigorous Functional Safety Requirements

Presenter: Robert Bielby, Micron

The growing momentum in the deployment of vehicles with increasing levels of ADAS is placing an ever increased focus on Functional Safety. Historically characterized by the ISO 26262 standard as a class II hardware element, Micron has disrupted the industry again through the introduction of the industry's first and only ASIL D qualified LPDDR 5 memory which accurately characterizes and supports systematic fault coverage, consistent with a class III hardware element. Through the introduction of this leadership product family, significant cost savings, risk reduction, and faster time to market can be achieved for the memory integrator vs. approaches historically employed to achieve requisite ASIL. Functional safety is an essential aspect of the development of advanced automotive systems, especially as the industry moves into advanced ADAS applications and autonomous driving. And an increased focus on functional safety on DRAM component, memory subsystem and automotive system levels will benefit will benefit automakers designing next generation vehicles. In this presentation, Micron will discuss JEDEC DRAM in the context of functional safety, with a focus on random and systematic fault mitigation.


Interface Performance and Security for Automotive Code Storage

Presenter: Stephan Rosner, Infineon

Automotive compute systems rely on low-latency nonvolatile memory (NVM) subsystems for fast boot and for fast access to applications. Embedded NVM (eNVM) with its inherently wide data paths offers not only high data rates of multiple GBytes/s, but also desirable security properties. eNVM capabilities are typically not supported in advanced process nodes below 2x nm. The transition of automotive MCUs to such nodes therefore requires to move eNVM off-chip while maintaining the required data rates of GBytes/s as well as protection for the information that is now located outside the well-secured MCU. This paper discusses a practical solution to this problem based on combining NVM with LPDDR4 technology. Furthermore, critical security challenges for moving eNVM to external memory are discussed.


Afternoon Session

1:00-1:20PMCase for Standardized Mission Profiles for Automotive

Presenters: Peter Turlo, Onsemi

The transition from the legacy Internal Combustion Engine (ICE) to the contemporary Battery Electric Vehicle (BEV) automotive platforms resulted in the development of automotive electronic systems not previously employed in ICE applications. Along with proliferation of control systems supporting various functions related to sensing and connectivity resulted in an exponential growth of electronic content in contemporary automotive platforms that can be subjected to use conditions that can differ from the legacy use conditions originally developed for ICE platforms. Years of collective industry ICE platform knowledge enabled the standardization of the qualification procedures applied to automotive semiconductor products; facilitating an efficient and cost-effective semiconductor product development and qualification process supporting the deployment of (non-ASIC) catalog products destined for the general automotive market. Today, the multiple iterations of yet to be standardized contemporary use conditions provided by multiple endusers for similar end applications are causing inefficiencies in the product development and qualification. process. The presentation will speak to the concept of Standardized Mission Profiles as applied to some of the automotive applications seen in contemporary automotive platforms.

1:20AM-1:40PMLPDDR and Its Ever Changing Test Challenges for Automotive

Presenters: Brig Asay, Keysight Technologies

As autonomous driving continues to take hold in the automotive market, increasingly automotive vendors are adopting to faster LPDDR technologies much earlier in the overall LPDDR technology life cycle. No longer can the automotive industry be satisfied with more stable, more mature technologies, but rather they must move quickly to adapt the faster technologies so they can be quicker in their deployment of the latest autonomous technologies. Of course faster adoption comes with many price tags and one that might not be top of mind is the fact that with faster technologies, comes an entirely new set of testing challenges. Test engineers now must understand how equalization, de-embedding and even receiver calibration must be done to successfully test tomorrow’s automotive designs. This lecture will discuss these testing challenges, various test equipment (BERT versus AWG) and what can be done to prepare your testing needs for next generation LPDDR technologies.


Aiming at a Collision-free Society - Advanced Driver Assistance and Automated Driving

Keynote Presenter: Yoichi Sugimoto, Honda R&D Co., Ltd.

Honda aims at zero traffic fatality globally by 2050. We keep working on continuous evolution of advanced driver assistance system (ADAS), including the world’s 1st Collision Mitigation Brake System (CMBS). To eliminate human errors, we have been developing automated driving technologies. The world’s 1st Level 3 automated driving was deployed in 2021.

Honda keeps struggling to realize a collision-free society as soon as possible, accelerating evolution of ADAS with technologies and knowledge acquired through the development of automated driving.

2:10-2:30PMAdvanced Imaging and Sensing Technologies in ADAS Systems

Presenter: Tsutomu Haruta, Sony Semiconductor Solutions Corporation

The number of ADAS systems in the automotive industry using imaging technology is steadily increasing year over year to help make vehicles safer for drivers, passengers and pedestrians. Most current commercially available systems are based on CIS technology, but next generation systems are increasingly looking to adapt some level of depth sensing technologies. In this session, it will show you which image sensor characteristics are important in order to provide robust and reliable ADAS sensing systems from traditional CIS solutions, and also it will touch upon LiDAR depth sensing technologies.

2:30-2:50PMMarket Trend and Digital Chassis Solutions Powered by Qualcomm

Presenter: Toshiya Matsui, Qualcomm CDMA Technologies

"Manufacturing", "Sales & Maintenance", "Evolving Consumer Expectations", "In-Car Experiences" and the search for new revenue generators.

The future of automotive is electrified, autonomous, shared, connected and updated. For such trends, the evolution of vehicle architecture has accelerated, significantly changing the E/E architecture. Vehicles will be connected by intelligent edge and 5G technology, thereby evolving for smart transportation.

QUALCOMM will introduce a platform for the future of automotive "Digital Chasses" and system architecture redefining vehicles for the 21st century. Accelerating a more connected, immersive, smart, autonomous and efficient future.

2:50-3:10PMIntroduction of Automated Shuttlebus in Campus

Presenter: Manabu Omae, Keio University

An automated shuttlebus practically operated in the campus of Keio University is introduced. The steering and speed of the shuttle bus are controlled based on precise digital map and localization using RTK-GNSS and LiDAR sensors. The current level of the autonomous-driving shuttle bus is Lv.2, and we are challenged to raise the level to Lv.4 by 2025. In the presentation, vehicle control of the automated shuttle bus is introduced. Low computational load for the control is realized by the use of precise map information stored as raster data.

3:30-3:50PMAn Advanced Transient Thermal RC model for prediction of Junction and Measurement points

Presenter: Takuya Shinoda, Denso Corporation

The thermal design issues of electronic control products in the automotive industry are presented, and the transient thermal (RC) model is introduced as one of the industry standard models for the future of design in thermal analysis. The model for heat transfer analysis can be verified to respond to electronic control specifications by calculating junction temperatures with high accuracy. The model is produced with two types of thermal resistance data. These data are the manufacturer's guaranteed values and the measured transient thermal resistance values.

3:50-4:10PMContribution of Power Semiconductors to Social Challenges Toward Zero Emissions

Presenter: Gentaro Ookura, Toshiba Electronic Devices & Storage Corporation

In recent years, the automotive industry has been undergoing technological innovation in the four megatrends of CASE (Connected, Autonomous, Sharing, and Electric). In this context, the trend toward zero emissions among OEMs is further accelerating following the COP26 resolution held in Glasgow last year, and the automotive industry's efforts to reduce CO2 emissions are expected to expand the number of xEV (B-EV, PHEV , HEV and 48 VMHEV).

Technological innovation of electric-related systems is the key to these xEV, and performance improvement of power devices, which are used in many of these vehicles, is contributing greatly to system improvement.

Toshiba Device & Storage Products has developed cutting-edge power semiconductor technologies for industrial infrastructure, consumer, and automotive applications, and has earned the trust of the industry based on its long track record. In this seminar, we will introduce the latest trends in MOSFETs for cutting-edge Si-based and SiC semiconductors.

4:10-4:30PMAutomotive Memory IP – Building the Car of Tomorrow

Presenter: Brett Murdock, Synopsys Inc.

New trends, the shift to zonal architecture, and use of AI is reshaping Automotive SoCs, requiring more compute processing performance. Such transitions are requiring faster data movement for applications such as ADAS and in-vehicle communication, increasing the need for high-speed interfaces. This presentation will describe the new automotive trends, outline the automotive requirements for functional safety, reliability and quality, and discuss options and challenges for the latest memory technologies to be used in the automotive environment.


Storage Trend in Automotive Systems and KIOXIA's Strategies

Presenters: Tetsuya Yamamoto, KIOXIA Corporation & Isao Yamamoto, KIOXIA Corporation

To improve vehicle safety, effectiveness & customer experiences, installing “Connected” & “ADAS” are becoming more in demand. In other words, it means the vehicle itself is more “intelligent” by adopting IT-based technologies.

In the new sophisticated systems, the value of flash storage is gaining as one of the key components by storing the valuable software & data in a variety of capacities, interfaces, & form factors with high availability.

KIOXIA is producing various flash storage devices for the automotive industry based on a combination of the latest storage technologies & our own cutting-edge NAND flash technologies.

In this session, we will share our views on technology trends in the automotive industry and introduce the possibilities of enormous advantages to be realized by our products.

5:00-5:05PMClosing Remarks

Presenter: Takashi Yamada, JEITA

Session details coming soon.


Program, topics and speakers subject to change without notice.